A 3D IC is a metal-oxide semiconductor (MOS) integrated circuit(IC) manufactured by incorporating two or more layers of silicon wafer or dies in a single package and is interconnected vertically as well as horizontally using through-silicon vias (TSVs) or Cu-Cu connection. The 3D IC technology is a viable solution for achieving electrical performance benefits such as the thickness of the layers, diameter and density of TSVs as a single device which plays significant role in exploiting the z-direction at reduced power and smaller footprint than traditional 2D processes. This emerging technology is utilised in large-scale for consumer electronics and telecommunication industry such as tablets, smartphone, and smart TVs.
3D ICs provides reduced timing delays, reliability, fast response, durability, better memory to the upcoming smart devices. 3D ICs facilitate the development of light weight, handy consumer goods due to reduced chip size that provides higher bandwidth with exceptional speed and much low power consumption over 2D solutions. IC manufacturers use various fabrication process for 3D ICs such as beam recrystallization, wafer bonding, silicon epitaxial growth thus enhancing product quality standards in the market. Ongoing innovation and improvisation of technologies leading to miniaturization of devices will cause the 3D ICs market share to grow significantly in coming years.
Top Impacting Factors: Market Scenario Analysis, Trends, Driver, and Impact analysis
Increase in demand for 3D packaging used in advanced electronic portable devices and industrial products such as MEMS, sensors, RF SiP, HB LED, significant reduction in data loss and restiveness towards the vibration of device and surge in demand for memory enhanced solutions with 3D IC integration are listed primary factors driving the 3D IC market growth. However thermal and testing glitches due to high power density of 3D ICs, thermal-mechanical stress causing potential reliability problems such as cracking due to TSV induced overheads and complex design challenges due to lack of skilled workforce are obstacles hindering 3D ICs market growth. Contrarily Silicon-on-insulator substrate type 3D ICs boost the growth in consumer electronics and healthcare sector as it is able to cut down excessive heat production and scrounging capacitance thus fulfilling the need to integrate disparate technologies. Extensive technological advancement and increasing adoptability of 32GB or 64GB High-bandwidth Memory (HBM) DRAM, 3D NAND in smart mobile and automotive devices are anticipated to pave new avenues to the 3D ICs industry.
New Product Launches to flourish the market:
Leading 3D ICs market players are taking necessary actions to provide fully-integrated, high-performance, environment-friendly optimized solutions to achieve unparalleled levels of multi-die integration, co-design and faster time to convergence.
In April 2020, Synopsys Inc., an American electronic design automation company, introduced 3D IC compiler platform to transform design and integration of complex 2.5 and 3D multi-die system in a package which have become paramount to meet system-level performance, power, area and cost requirements. This 3D IC compiler is built on Synopsys Fusion Design Platform SoC-scale, offering single intuitive environment with planning, architectural exploration, design, implementation, analysis and sign-off all-in-one accompanied by 3600 3D user-friendly visualization capabilities for all views. This technology reduces overall integration time and enables faster convergence reducing need for iteration.
Surge in use in industrial and automotive applications
In September 2019, it was reported that Intel along with Taiwan Semiconductor Manufacturing Company Ltd. are developing future packages based on Cu-Cu hybrid bonding which provides a way to stack advanced dies using copper connections at chip level enabling new type of 3D ICs and memory cubes.
Traditional System-on-chip (SoC) are becoming too bulky and expensive at advanced nodes so they are developing 2.5D/3D and advanced packages using interconnects that are used to connect a die to another die or to separate interposer as in 2.5D. Most advanced copper microbumps and pillars are tiny structures with 40µm pitch involving 25µm copper pillar in size with 15µm spacing. Organizations are planning to adopt direct bond interconnect or hybrid bonding as they get to 20µm to 10µm and below pitches. Copper hybrid technology has been used for advanced CMOS image sensors but using this for advanced chip stacking is challenging and involves complex processes resulting in the launch of the first products by 2021.
Key benefits of the stakeholders:
- The study gives an analytical overview of 3D ICs market forecast with current trends and future estimations to determine imminent investment pockets.
- The report provides information related to key drivers, restraints, and opportunities along with detailed 3D ICs market analysis.
- The 3D ICs trends quantitatively analyzed.
- Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market.
COVID-19 scenario Analysis:
- After the COVID-19 outbreak in Wuhan, the 3D ICs market is among the most impacted as manufacturing units, which are mostly in China, have to shut operations leading to severe disruption of supply chain. There is a short-term demand lapse, which has led 3D ICs market share to fall, owing to lockdown of operations and travel restrictions on a global basis.
- Contrarily the 3D ICs industry sees an opportunity in the unprecedented crisis as organizations begin to work-from-home and end-users begin to consume more content on digital platforms, thus surging importance of storage and memory solutions for data centers, laptops, and other devices.
- Long-term effect is expected to be minimal and the demand shortfall is likely to trigger an oversupply driven by pent-up demand. In April 2020, Micron Technology, a US-based chip design and storage solution company said that there is higher demand from data centers, owing to remote-work economy, virtual learning by students and increased e-commerce activity.
- In March 2020, San Mateo, a California-based company reported 3–6% decline in annual revenue of semiconductor companies with a probability of 54%, whereas by 24% probability annual revenues is expected to drop by 12% or more. The supply chain would start to recover with ease of regulations on travel restrictions by governments worldwide to somehow ensure component availability.
Questions answered in the 3D ICs Market research report:
- Who are the leading players in the 3D ICs market?
- What are the current trends that would influence the market in the next few years?
- What are the driving factors, restraints, and opportunities in the 3D ICs market?
- What are the projections for the future that would help in taking further strategic steps?
- What would be the detailed impact of COVID-19 on the market?
3D ICs Market Report Highlights
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 Key Market Players | AMKOR TECHNOLOGY, Xilinx Inc., Toshiba Corporation, Samsung Electronics Co. Ltd., ASE GROUP, INTEL CORPORATION, United Microelectronics Corporation., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, STMicroelectronics N.V., Micron Technology, Inc. |
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