Thin Wafer Processing and Dicing Equipment Market Expected to Reach $1.2 Billion by 2031—Allied Market Research

According to a new report published by Allied Market Research, titled, “Thin Wafer Processing and Dicing Equipment Market By Equipment Type (Thinning Equipment, Dicing Equipment), By Wafer Size (Less Than 4 Inch, 5 Inch And 6 Inch, 8 Inch, 12 Inch), By Application (Memory And Logic, MEMS Devices, CMOS Image Sensors, Power Devices, RFID): Global Opportunity Analysis And Industry Forecast, 2022-2031" The thin wafer processing and dicing equipment market was valued at $643.78 million in 2021, and is estimated to reach $1.2 billion by 2031, growing at a CAGR of 6.7% from 2022 to 2031.

The equipment used in the production of thin wafers is thin wafer processing and dicing equipment. The integration of various microelectronics into various consumer electronics and smart cards requiring thinner wafers is increasing rapidly. Technologies such as MEMS devices, power devices, and RFID are considered to be the main sources of thin wafers. The demand for mentioned semi-electronics is increasingly generating demand for an improved manufacturing process, majorly processing & dicing.  

Thin wafers are semiconductor substrates that undergo a critical process in semiconductor manufacturing, particularly for advanced integrated circuits and MEMS devices. Thinning the wafers is essential to achieve the desired thickness while maintaining the integrity of the semiconductor materials. To accomplish this, thin wafer processing equipment, including grinding machines, chemical-mechanical polishing (CMP) systems, and wet etching systems, is employed. These tools effectively remove excess material from the backside of the wafer, ensuring a uniform thickness and minimizing any potential damage. Subsequently, dicing is performed to cut the wafers into individual semiconductor chips or dies. After undergoing various processing steps, the wafer is diced to create separate electronic components. Dicing equipment utilizes various cutting techniques, such as mechanical sawing or laser ablation, to achieve precise and clean cuts. To ensure accuracy, dicing equipment may incorporate wafer alignment systems, enabling precise positioning before the cutting process. The dicing process demands high precision to safeguard against chip damage and maximize the yield of viable dies from each wafer. 

Moreover, thin wafer processing and dicing equipment are used in semiconductor manufacturing to handle and process thin wafers. Thin wafer processing involves machines like grinding machines, CMP systems, and wet etching systems to reduce wafer thickness while maintaining semiconductor integrity. Dicing equipment cuts wafers into individual semiconductor chips, creating discrete electronic components. These tools ensure precision control to achieve uniform thickness, minimize wafer damage, and maximize chip yield. These processes are critical for producing advanced integrated circuits and MEMS devices, enabling the development of smaller, more efficient, and high-performance electronic devices used in various applications like smartphones, computers, and IoT devices.

The constantly rising demand for consumer electronics products and the merging of the electronics and automotive industries are two reasons contributing to the market's expansion. These factors fuel the hunt for semiconductor manufacturing and expanding the application of wafer processing. The aforementioned factors are having a beneficial effect on thin wafer processing and dicing equipment manufacture, which in turn is driving market expansion. In addition, the expansion of artificial intelligence, the Internet of Things (IoT), and connected devices in a variety of industries is anticipated to offer plenty of potential prospects to the participants in the thin wafer processing and dicing equipment market share.  

Country-wise, the rest of Asia-Pacific region holds a significant share in the global thin wafer processing and dicing equipment market size, owing to the presence of prime players. Major organizations and government institutions in these countries are intensely putting resources into these global automotive data cables, these prime sectors have strengthened the thin wafer processing and dicing equipment market growth in the region.  

KEY FINDINGS OF THE STUDY 

• In 2021, by equipment type, the dicing equipment segment accounted for maximum revenue and is projected to grow at a notable CAGR during thin wafer processing and dicing equipment market analysis. 

• By application, the memory and logic segment was the highest revenue contributor to the market, with $210.29 million in 2021 during the thin wafer processing and dicing equipment market trends. 

• By wafer size, the 5-inch and 6-inch segment was the highest revenue contributor to the thin wafer processing and dicing equipment market and is estimated to reach $468.96 million by 2031, with a CAGR of 6.08%. 

• Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market, accounting for the highest revenue share in 2021.  

The thin wafer processing and dicing equipment market key players profiled in the report include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. Market players have adopted various strategies, such as product launches, collaborations & partnerships, joint ventures, and acquisitions to expand their foothold in the thin wafer processing and dicing equipment industry.