Wafer Level Packaging Market Expected to Reach $23.6 Billion by 2030—Allied Market Research

According to a new report published by Allied Market Research, titled, “Wafer Level Packaging Market," The wafer level packaging market size was valued at $4.5 billion in 2020, and is estimated to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030. Asia-Pacific is expected to be the leading contributor toward the wafer level packaging market during the forecast period, followed by LAMEA and Europe.

WLP is used for interconnecting semiconductor devices such as micro sensors, microscopic devices, microprocessors, and others to external circuitry while utilizing deposited solder bumps onto the chip pads. It allows integration of wafer fab, packaging, burn-in, and test at wafer level to streamline the manufacturing process undertaken by a device.

Growth of the global wafer level packaging industry is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the wafer level packaging market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.

Moreover, developing nations tend to witness high penetration of wafer level packaging products, especially in healthcare segment, which is anticipated to augment the market growth. Factors such as technological advancements and innovations in wafer level packaging products accelerate the market growth. Also, In semiconductor advance packaging sector wlcsp package, wlcsp process flow, and wafer chip scale package are in the latest trends.

The global wafer level packaging industry is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others. Also, the report provides a detailed Wafer level packaging market Analysis based on competitive intensity and how the competition will take shape in coming years.

Region wise, the wafer level packaging market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific contributed maximum revenue in 2020. Also, between 2020 and 2030, the wafer level packaging market in Asia-Pacific is expected to grow at a faster rate as compared to other regions. This is attributed to increase in demand from emerging economical countries such as India, China, and South Korea.

KEY FINDINGS OF THE STUDY

• The fan in wafer level packaging segment is projected to be the major technology, followed by fan out wafer level packaging.
• Asia-Pacific and North America collectively accounted for more than 75% of the wafer level packaging market share in 2020.
• India is anticipated to witness highest growth rate during the forecast period.
• U.S. was the major shareholder in the North America wafer level packaging market, accounting for approximately 69% share in 2020.
• Depending on type, the consumer electronics segment generated the highest revenue in 2020. However, the others segment is expected to witness the highest growth rate in the future.
• Region wise, the wafer level packaging market was dominated by Asia-Pacific. Also, Asia-Pacific is expected to witness significant growth in the coming years.

The key players profiled in the report include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation. These players have adopted various strategies such as partnership, acquisition, and product launch to strengthen their foothold in the industry.