Wafer Processing Equipment Market Research, 2031
The global wafer processing equipment market size was $8.5 billion in 2021, and is projected to reach $14.4 billion by 2031, growing at a CAGR of 5.3% from 2022 to 2031. The global wafer processing equipment market is expected to grow rapidly in the coming years. Wafer, also known as substrate, is a thin slice of semiconductor, such as a crystalline silicon germanium and gallium arsenide. A semiconductor is a material with moderate electricity conducting properties. It also has properties such as variable resistance, easy current flow in one direction than the other, and sensitivity to light and heat. These properties make it useful for amplification, switching, and energy conservation. The semiconductors first need to be converted into thin wafers, which can be used in fabrication of integrated circuits, in photovoltaics, to manufacture solar cells. Thus, the importance of wafer in microelecronic devices is the key driver in the growth of the market. Wafers are extensively used in computers, smartphones, laptops, and even in microelectronic devices such as sensors, which ensure the rapid growth of the market throughout the forecast period.
These equipment are used to convert semiconductors such as crystalline silicon germanium, and gallium arsenide into thin round slices, which can be used as a substrate for microelectronic devices. The process includes activities such as formation, texturing, cleaning, dicing and etching. The texturing of wafers is done as per the application of the wafer. For instance, rough textures are created on wafers to be used for solar cells. The increasing use of electronics, has exponentially raised the demand for wafers, which ensures substantial growth of the wafer processing equipment industry throughout the forecast period.
However, tariff disruption due to trade war between the U.S. and China resulted in decrease of the electronic industry market share in North American regions that is limiting the growth of the market.
In addition, during the outbreak of the COVID-19 pandemic, construction, manufacturing, hotel, and tourism industries were majorly affected. Manufacturing activities were halted or restricted. This led to decline in manufacturing of various equipment used for wafer processing equipment as well as their demand in the market, thereby restraining the growth of the wafer processing equipment market. Conversely, industries are gradually resuming their regular manufacturing and services. This is expected to lead to re-initiation of the manufacturing companies at their full-scale capacities, that helped the wafer processing equipment market to recover by end of 2021.
By Process
Etch segment holds the largest share in the market
On the contrary, the growing demand for light weighted electronic components for designing the thin electronic devices is expected to offer new opportunities for the market.
The wafer processing equipment market growth is segmented into Process, Application and End User. By process, the wafer processing equipment market is segmented into deposition, etch, mass metrology and strip & clean. By application, the market is categorized into dicing, grinding & probing, polishing, edge shaping and cleaning. By end user, the market is divided into computer, communication, consumer, industrial and others. By region, the wafer processing equipment market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
By Application
Cleaning segment is projected to grow at a highest CAGR
On the basis of process, in 2021 the etch micron segment dominated the wafer processing equipment market, in terms of revenue, and the mass metrology segment is expected to witness growth at the highest CAGR during the forecast period. As per application, in 2021, the dicing segment led the wafer processing equipment market, and the cleaning segment is expected to exhibit highest CAGR in the near future. By end user, the computer segment led the market in 2021, in terms of revenue and the industrial segment is anticipated to register highest CAGR during the forecast period. Region wise, Asia-Pacific garnered the highest revenue in 2021; and is anticipated to register highest CAGR during the forecast period.
COMPETITION ANALYSIS
The major players having significant wafer processing equipment market share profiled in the report are Applied Materials, Inc, DISCO , Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc. , Nikon Corporation, Plasma-Therm, SPTS Technologies Ltd. and Tokyo Electron Limited. Major companies in the market have adopted product launch, partnership, business expansion, and acquisition as their key developmental strategies to offer better products and services to customers in the wafer processing equipment market.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the wafer processing equipment market analysis from 2021 to 2031 to identify the prevailing market opportunities.
- The wafer processing equipment market forecast is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network for wafer processing equipment market outlook.
- In-depth analysis of the wafer processing equipment market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global wafer processing equipment market trends, key players, market segments, application areas, and market growth strategies.
Wafer Processing Equipment Market Report Highlights
| Aspects | Details |
 Market Size By 2031 | USD 14.4 billion |
 Growth Rate | CAGR of 5.3% |
 Forecast period | 2021 - 2031 |
 Report Pages | 218 |
 By Process |
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 By Application |
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 By End User |
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 By Region |
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 Key Market Players | Motorola Solutions, Inc., Applied Materials, Inc., Tokyo Electron Limited, KLA Corporation, Nikon Corporation, Lam Research Corporation, DISCO, Plasma- Therm, Spts technologies ltd., Hitachi kokusai linear |
Analyst Review
Adoption of light weighted materials for manufacturing different electronic products is increasing owing to the adoption of wafers which in turn is growing the adoption of wafer processing equipment. In addition, low cost of raw materials for manufacturing the wafers is increasing its adoption.
Major players having wafer processing equipment market share are adopting agreements and product launches as key developmental strategies to improve their product portfolio, and thereby drive the growth of the market. Moreover, rise in adoption of internet of things (IOT), cloud-based system, and internet systems fuels the growth of the wafer processing equipment market.
Conversely, technological innovation in the market is expected to provide lucrative opportunities for the better wafer processing equipment market outlook.
The global wafer processing equipment market was valued at $8,521.0 million in 2021, and is projected to reach $14,416.1 million by 2031, registering a CAGR of 5.3% from 2022 to 2031.
The forecast period considered for the global wafer processing equipment market is 2022 to 2031, wherein, 2021 is the base year, 2022 is the estimated year, and 2031 is the forecast year.
The latest version of the global wafer processing equipment market report can be obtained on demand from the website.
The base year considered in the global wafer processing equipment market report is 2021.
The top companies holding the market share in the global wafer processing equipment market report Applied Materials, Inc, DISCO, Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc., Nikon Corporation, Plasma-Therm, Spts Technologies Ltd and Tokyo Electron Limited.
The top seventeen market players are selected based on two key attributes - competitive strength and market positioning.
The report contains an exclusive company profile section, where leading companies in the market are profiled. These profiles typically cover company overview, geographical presence, market dominance (in terms of revenue and volume sales), various strategies and recent developments.
By process, the etch segment is the highest share holder of wafer processing equipment market.
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