Quad-Flat-No-Lead Packaging Market Research, 2031
The global quad-flat-no-lead packaging market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031. As global mobility grows, consumers who want to remain connected in the digital world need smaller and lighter items. To accommodate this demand, consumer electronics makers are working to reduce product size. Miniaturization of products is made possible by smaller, thinner, and thermally improved containers. Various research revealed that quad-flat-no-lead (QFN) packages outperform dual in-line surface-mount technology (SMT) packages in terms of thermal performance. In addition to low inductance and capacitance, QFN packages have a tiny package volume, a smaller board routing area, and no external leads as compared to conventional leaded packages. Electronic component manufacturing companies have selected QFN packaging as one of the methods for electronic component manufacturing to accomplish product simplification.
The quad-flat-no-lead package has tiny, closely spaced pins. They are easily harmed and deformed by careless handling. Also, accurately reformatting them is exceedingly challenging. They must be stored carefully to prevent damage, and they are frequently transported in specialized packaging to offer sufficient security. This packaging minimizes handling and lowers the danger of damage to an absolute minimum. These factors are anticipated to hinder the quad-flat-no-lead packaging market growth.
Quad flat no-lead packaging technology is the fastest-growing IC packaging solution today. QFN packaging's flexible form factor enables the technology to serve all markets while fulfilling unique dimensional and application requirements. The QFN packaging solution is being used in various markets to address space and functionality challenges. MLF is evolving into a popular and adaptable solution in the sensor and microelectromechanical systems areas. The automobile industry still relies on QFN technology for solutions across the board for the deployment of vehicle electronics. Applications include battery control management systems, automatic windscreen wiper systems, and even sophisticated moisture-sensing systems.
The key players profiled in this report include Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., Tianshui Huatian Technology Co.,Ltd, ChipMOS TECHNOLOGIES INC.
The global quad-flat-no-lead packaging market is segmented on the basis of type, moulding method, terminal pads, industry vertical, and region. By type, the market is sub-segmented into air-cavity QFN, plastic-moulded QFN, and others. By moulding method, the market is classified into punched and sawn. By terminal pads, the market is classified into fully exposed terminal ends, pull-back terminal ends, and side wettable flank terminal ends. By industry vertical, the market is classified into consumer electronics, industrial, automotive, computing/networking, and communications. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The quad-flat-no-lead packaging market is segmented into Terminal Pads, Industry Vertical, Type and Moulding Method.
By type, the air-cavity QFN sub-segment dominated the market in 2021. An improved version of the standard plastic molded QFN is the air-cavity QFN packaging. The chip is surrounded by air, and the metal leads are soldered straight to a printed circuit board. The containers' sidewalls and lids are frequently composed of ceramic material, which allows them to withstand high temperatures without breaking, melting, flowing, or decomposing. These factors are anticipated to create a Quad-Flat-No-Lead Packaging Market Opportunity in the near future.
By terminal pads, the fully exposed terminal ends sub-segment dominated the global quad-flat-no-lead packaging market share in 2021. The totally exposed terminal end is the typical packaging used for consumer and industrial goods. The side walls of the leads in an Active-Semi standard QFN package are not coated because the plating procedure takes place before package singulation. This type, such as pull-back terminal ends and side wettable flank terminal ends, exposes the terminals entirely at the package edge and package side. The medium access control layer protocol of multiple access with a collision avoidance approach can be used to handle terminal problems, such as those associated with wireless ad hoc networks.
By molding method, the punched sub-segment dominated the global quad-flat-no-lead packaging market share in 2021. The punched QFN molding method is distinguished by stamping and die-cutting the outside lead wire. The package's outer pins are stamped with a die due to the resin sealing of each cavity. There is a very small protruding pin on the outside of the circuit board because the pressure is cut off during punched molding method.
By industry vertical, the consumer electronics sub-segment dominated the global quad-flat-no-lead packaging market share in 2021. An important advancement is in the automotive industry, namely in the area of electronic car accessories. Automobile technology, including infotainment systems magnetic sensors for steering controls, moisture sensing systems for automatic windshield wipers, and other frequently utilized features by automakers, sparks interest in affordable packages like QFN is widely used. These factors are anticipated to boost the demand for quad-flat-no-lead packaging market share in the automobile market.
By region, Asia-Pacific dominated the global market in 2021 and is projected to remain the fastest-growing sub-segment during the forecast period. The QFN packaging technology is widely used for semiconductor manufacturing and semiconductors manufacturing is concentrated in the Asia-Pacific region. In addition, the government is launching a number of programs to boost the market for semiconductor manufacturing equipment. As an illustration, the governments of Asian nations with growing economies are dedicated to focusing on obtaining FDI for the development of their economies. To this end, the government authorities establish various FDI attraction methods. These substantial expenditures enable the introduction of new goods and services while strengthening several industries, particularly the semiconductor sector. These results aid start-ups and R&D efforts in the semiconductor business so they can compete in the market.
Impact of COVID-19 on the Global Quad-flat-no-lead Packaging Industry
- The semiconductors sector is significantly impacted by COVID-19 on both the supply and demand sides. Semiconductor companies were forced to cease operations due to a short-term imbalance in demand from the consumer electronics industry.
- Additionally, the supply chain was affected, which had an immediate effect on lead times, backlog commitments, projections, costs, and labor management.
- Due to the reduction in demand from the semiconductor manufacturing sector brought on by the COVID-19 pandemic, various governments throughout the world instituted limitations including lockdowns and social distancing rules, which had an influence on the semiconductor industry's ability to produce semiconductors. As a result, demand for quad-flat-no-lead technology decreased.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the Quad-Flat-No-Lead Packaging Market Forecast, segments, current trends, estimations, and dynamics of the quad-flat-no-lead packaging market analysis from 2021 to 2031 to identify the prevailing quad-flat-no-lead packaging market opportunities.
- Quad-flat-no-lead packaging market outlook is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the quad-flat-no-lead packaging market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global quad-flat-no-lead packaging market trends, key players, market segments, application areas, and market growth strategies.
Quad-Flat-No-Lead Packaging Market Report Highlights
| Aspects | Details |
 Market Size By 2031 | USD 1.1 billion |
 Growth Rate | CAGR of 8.8% |
 Forecast period | 2021 - 2031 |
 Report Pages | 293 |
 By Terminal Pads |
|
 By Industry Vertical |
|
 By Type |
|
 By Moulding Method |
|
 By Region |
|
 Key Market Players | ChipMOS TECHNOLOGIES INC., Tianshui Huatian Technology Co.,Ltd, STATS ChipPAC Pte Ltd, JCET Group, Texas Instruments Incorporated, ASE, Microchip Technology Inc., Powertech Technology Inc., NXP Semiconductors, Amkor Technology, Inc. |
Analyst Review
The consumer electronics and automobile industries are expected to rise rapidly. This enormous rise in demand is due to an increase in the use of cutting-edge technologies like consumer electronics and electronic car accessories. Electronics and automobile devices such as wristwatches, and others, are commonly utilized by customers, resulting in a demand for quad-flat-no-lead packaging technology. Also, every automobile manufacturer is now offering extra features like keyless locks and auto door unlocking devices. These gadgets increase demand for QFN packaging technology. In order to produce more compact and improved consumer electronics, manufacturers invest more in product innovation and provide their offerings in this quad-flat-no-lead packaging technology. It is extremely difficult to rework the device because of the good thermal properties of the quad-flat-no-lead package, as hot air reflow often cannot provide enough heat to the thermal pad without causing damage to the surrounding board material or components. These factors are anticipated to hinder the quad-flat-no-lead packaging market share. The growth of the quad-flat-no-lead packaging market can be attributable to a number of factors, including the increased need for QFN packages in developing nations and the growing desire for miniaturization across a range of applications, including portable electronics.
Among the analyzed regions, Asia-Pacific is expected to account for the highest revenue in the market by the end of 2031, followed by Europe, North America, and LAMEA. Rapid industrialization and urbanization are the key factors responsible for the leading position of Asia-Pacific in the global quad-flat-no-lead packaging market.
Quad flat no-lead packages are lightweight and simple to handle. These packages come in both small form factors and thin profiles. The bond wires that link the die and frame are not long. These packages' lead inductance is minimal. It is a small, thin package that requires minimal surface area, making it perfect for any PCB design. Additionally, it is quite lightweight, making it suitable for boards made of thinner material.
Automotive sub-segment of the industry vertical acquired the maximum share of the global quad-flat-no- lead packaging market in 2021.
The growing application of quad-flat-no-lead packaging technology in the production of automotive accessories such as steering control, automatic wipers, and many others is anticipated to boost the quad-flat-no-lead packaging market in the upcoming years.
Asia-Pacific will provide more business opportunities for the global quad-flat-no-lead packaging market in the future.
Amkor Technology, Inc., Texas Instruments Incorporated, and the major players in the quad-flat-no-lead packaging market.
The major growth strategies adopted by quad-flat-no-lead packaging market players are investment and agreement.
Automotive industry and electronic devices manufacturers are the major customers in the global quad-flat-no-lead packaging market.
The report provides an extensive qualitative and quantitative analysis of the current trends and future estimations of the global quad-flat-no-lead packaging market from 2021 to 2031 to determine the prevailing opportunities.
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